JPH0325279U - - Google Patents
Info
- Publication number
- JPH0325279U JPH0325279U JP8500989U JP8500989U JPH0325279U JP H0325279 U JPH0325279 U JP H0325279U JP 8500989 U JP8500989 U JP 8500989U JP 8500989 U JP8500989 U JP 8500989U JP H0325279 U JPH0325279 U JP H0325279U
- Authority
- JP
- Japan
- Prior art keywords
- land
- electrode part
- printed wiring
- chip component
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007598 dipping method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8500989U JPH0325279U (en]) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8500989U JPH0325279U (en]) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325279U true JPH0325279U (en]) | 1991-03-15 |
Family
ID=31633877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8500989U Pending JPH0325279U (en]) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325279U (en]) |
-
1989
- 1989-07-21 JP JP8500989U patent/JPH0325279U/ja active Pending